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HYNIX SEMICONDUCTOR MANUFACTURING AMERICA ANNOUNCES $100 MILLION INVESTMENT TO UPGRADE EUGENE, OREGON FACILITY
Hynix Semiconductor Manufacturing America (“HSMA”), the U.S.
subsidiary of Hynix Semiconductor Inc. of Korea, announced today that it is
launching a $100 million upgrade to its DRAM fabrication facility in Eugene,
Oregon.
“We at HSMA are proud that our parent company has committed to keeping
the Eugene facility at the cutting edge of semiconductor manufacturing
technology,” Jerold Olson, a Hynix spokesperson stated.
“This upgrade will assure that our Oregon facility continues to compete
at the highest levels of the global semiconductor market.
It sends a strong message about Hynix’s confidence in the future of the
industry and the company.”
Hynix has invested over $1.6 billion to date in the Eugene, Oregon
facility, which manufactures 256 SDRAM and DDR.
These semiconductors are used in a wide variety of products.
HSMA employs over 850 individuals at the Eugene facility, along with 170
contract workers. HSMA is one of
the top private employers in Oregon.
“We at HSMA are sensitive to the fact that when we take into account
the direct and indirect employment effects of our operations, we are responsible
for the jobs of literally thousands of Oregonians,” Mr. Olson continued.
“At a time of economic uncertainty, secure, well-paid jobs are the
greatest benefit we can bring to Eugene, Oregon, and America.
In turn, our employees and their communities have been responsible for
the great success of our U.S. operations. This
is truly a ‘win-win’ investment. HSMA
and Hynix are doing our utmost to continue this success story long into the
future, and we appreciate the continuing support we have received from our
elected officials. Hynix and HSMA
are proud to be building a better future for our company and our employees in
Oregon.” Unlike previous
upgrades to the Eugene, Oregon facility, production will continue at the site
and will not affect current employees and operations. According to Farhad
Tabrizi, Vice President of Worldwide Marketing, the result of the upgrade to
“PrimeChip” technology will result in a production increase of more than
50%. “We anticipate a smooth
transition in the adoption of .13 micron technology which will provide HSMA with
optimum technology to continue to effectively supply 256M DRAMs to the market.
We expect the new HSMA product will primarily serve our U.S. customer base for
use in high end applications specially in the server market. About Hynix
Semiconductor Inc. Hynix Semiconductor
Inc. (HSI) of Ichon, Korea, is an industry leader in the development, sales,
marketing and distribution of high-quality semiconductors, including DRAM, SRAM,
Flash memory and system IC devices. Hynix Semiconductor is the world's leading
DRAM supplier with thirteen semiconductor-manufacturing facilities worldwide,
and production capacity of over 300,000 wafer starts per month. In addition,
Hynix is expanding its system IC business unit with leading technology and added
deep sub-micron foundry services to strategically broaden its overall
semiconductor presence and achieve its goal of leading the global semiconductor
market. Hynix maintains worldwide
development, manufacturing, sales and marketing facilities. |
